dt-bindings: Add snapshot of RPM SMD devicetree binding

Add snapshot of RPM SMD devicetree binding to the
devicetree project.This snapshot is taken as of
'commit <f7835e76aab01> ("drivers: thermal: Add support
for RPM SMD cooling device")' of the msm-4.14 kernel project.

Change-Id: Ib2fd5196575d3ae9cfd0276f5e4beb7f9057f46d
This commit is contained in:
Gopala Krishna Nuthaki committed 2021-07-29 23:33:20 +05:30
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commit cf272512ca
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Qualcomm Technologies, Inc. RPM SMD cooling device
The RPM shared memory(SMD) cooling device, will be used to set
different thermal band level to RPM hardware. When threshold violation
occurs, RPM SMD cooling device sends pre-configured thermal band level
to RPM hardware via SMD.
Required Parameters:
- compatible:
Usage: required
Value type: <string>
Definition: should be "qcom,rpm-smd-cooling-device"
- #cooling-cells:
Usage: required
Value type: <integer>
Definition: Must be 2. This is required by of-thermal and refer the doc
<devicetree/bindings/thermal/thermal.txt> for more details.
Example:
&rpm_bus {
rpm_smd_cdev: rpm-smd-cdev {
compatible = "qcom,rpm-smd-cooling-device";
#cooling-cells = <2>;
};
};